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Title:
CAMERA MODULE INCLUDING HEAT DISSIPATING STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME
Document Type and Number:
WIPO Patent Application WO/2020/204626
Kind Code:
A1
Abstract:
An electronic device including: a housing including a frame structure that forms a portion of a surface of the electronic device, a plate structure that is surrounded by the frame structure and that includes a first opening, a metal portion containing a metallic material and a polymer portion containing a polymer material; a support plate that faces the plate structure and that includes a polymer area formed of a polymer material; a printed circuit board that makes contact with part of the metal portion of the housing; a camera module disposed between the polymer portion included in the plate structure and the polymer area included in the support plate, the camera module including a camera bracket, a camera PCB, and a light emitting unit and a light receiving unit; and a heat dissipating structure that transfers heat generated from the camera module to the metal portion included in the housing

Inventors:
HUH JAEYOUNG (KR)
PARK KYUNGWAN (KR)
KANG SEUNGHOON (KR)
KIM BORAM (KR)
KIM YOUNGJIN (KR)
MOON SUNGHOON (KR)
MOON HONGKI (KR)
PARK YOONSUN (KR)
YUN HAJOONG (KR)
LIM JONGHOON (KR)
Application Number:
PCT/KR2020/004513
Publication Date:
October 08, 2020
Filing Date:
April 02, 2020
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
G03B17/55; H04N5/225; H05K1/02; H05K7/20
Foreign References:
US20180267390A12018-09-20
US20190058814A12019-02-21
CN207382424U2018-05-18
US9591215B12017-03-07
US10225954B22019-03-05
Attorney, Agent or Firm:
BAE, KIM & LEE IP (KR)
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