CAMERA MODULE, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC APPARATUS

WIPO Patent Application WO/2018/139260

A1

There is provided a camera module including: a stacked lens structure including a plurality of substrates with lenses, the plurality of substrates with lenses being respectively provided with a first through-hole and a second through-hole having different opening widths, and being stacked and bonded to each other by direct bonding, at least the first through-hole of the first through-hole and the second through-hole including a lens disposed therein; and a light receiving element including a plurality of light receiving portions configured to receive light entering through a plurality of first optical units each including the lenses stacked in an optical axis direction in such a manner that the plurality of substrates with lenses are stacked and bonded to each other by direct bonding, the plurality of first optical units arranged at a first pitch, the plurality of light receiving portions being provided corresponding to the plurality of first optical units.

JPH07306326	PRODUCTION OF OPTICAL WAVEGUIDE OR PLATE MICROLENS
WO/2018/163936	OPTICAL COMPONENT AND METHOD FOR PRODUCING OPTICAL COMPONENT
JP2012058388	EXPOSURE DEVICE

YAMAMOTO ATSUSHI (JP)

PCT/JP2018/000955

August 02, 2018

January 16, 2018

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SONY SEMICONDUCTOR SOLUTIONS CORP (JP)

G02B3/00; G02B13/00; G02B27/00

US20150256745A1	2015-09-10
US20160252721A1	2016-09-01
US20160006913A1	2016-01-07
US20160124196A1	2016-05-05
US20150312450A1	2015-10-29
US8000041B1	2011-08-16
JP2009279790A	2009-12-03
JP2011138089A	2011-07-14
JP2010256563A	2010-11-11
JP2013001091A	2013-01-07
JP2010204631A	2010-09-16
JP2015102794A	2015-06-04

NISHIKAWA Takashi et al. (JP)

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