Title:
CAMERA MODULE AND MOBILE PLATFORM
Document Type and Number:
WIPO Patent Application WO/2022/000297
Kind Code:
A1
Abstract:
A camera module and a mobile platform. The camera module comprises: a camera housing (103) having an accommodation space thereinside; an image acquisition unit arranged in the accommodation space; and a heat conduction unit separately in contact with the image acquisition unit and the camera housing (103) so as to conduct heat of the image acquisition unit to the camera housing (103). The heat conduction unit comprises a middle portion (114) and an edge portion (115), and the middle portion (114) is in contact with the image acquisition unit; the edge portion (115) is attached to the camera housing (103), so that the heat conduction unit is substantially sealed with the camera housing (103). Heat on the image acquisition unit is conducted to the camera housing by means of the heat conduction unit, thereby effectively relieving the problem of shortened service life caused by overheating of the image acquisition unit.
Inventors:
PENG ZELIN (CN)
XIE CHENGHAO (CN)
LI HONGSHAN (CN)
XIE CHENGHAO (CN)
LI HONGSHAN (CN)
Application Number:
PCT/CN2020/099387
Publication Date:
January 06, 2022
Filing Date:
June 30, 2020
Export Citation:
Assignee:
SZ DJI TECHNOLOGY CO LTD (CN)
International Classes:
G03B17/55; H05K7/20
Foreign References:
| CN108924393A | 2018-11-30 | |||
| CN107113371B | 2020-06-05 | |||
| CN105573014A | 2016-05-11 | |||
| CN202677045U | 2013-01-16 | |||
| CN208013643U | 2018-10-26 | |||
| CN208890902U | 2019-05-21 | |||
| JP2018137401A | 2018-08-30 |
Attorney, Agent or Firm:
P. C. & ASSOCIATES (CN)
Download PDF: