CAMERA MODULE AND MOLDED CIRCUIT BOARD ASSEMBLY, CIRCUIT BOARD AND APPLICATION THEREOF

Title:

CAMERA MODULE AND MOLDED CIRCUIT BOARD ASSEMBLY, CIRCUIT BOARD AND APPLICATION THEREOF

Document Type and Number:

WIPO Patent Application WO/2018/141295

Kind Code:

A1

Abstract:

Provided by the present invention are a camera module and a molded circuit board assembly, circuit board and application thereof, the circuit board comprising a digital circuit part, an analog circuit part and a substrate. The digital circuit part and the analog circuit part are respectively formed on the substrate, and the digital circuit part and the analog circuit part mutually conduct, wherein at least one part of the analog circuit part is a safe distance from the digital circuit part so as to prevent an electromagnetic wave generated by a circuit of the digital circuit part from interfering with an electrical signal transmitted and processed by the analog circuit part, thereby improving the stability and reliability of the transmission and processing of the electrical signal by the circuit board.

Inventors:

WANG MINGZHU (CN)
CHENG DUANLIANG (CN)
XI FENGSHENG (CN)
ZHAO BOJIE (CN)
TANAKA TAKEHIKO (JP)
HUANG ZHEN (CN)
CHEN ZHENYU (CN)
GUO NAN (CN)

Application Number:

PCT/CN2018/075334

Publication Date:

August 09, 2018

Filing Date:

February 05, 2018

Export Citation:

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Assignee:

NINGBO SUNNY OPOTECH CO LTD (CN)

International Classes:

H04N5/225; G01S17/36; H05K1/02

Foreign References:

CN104126131A	2014-10-29
CN105657957A	2016-06-08
CN104639090A	2015-05-20
CN105848406A	2016-08-10
CN1697189A	2005-11-16
CN105742304A	2016-07-06
US20080165620A1	2008-07-10

Other References: