CAMERA MODULE, MOULDED PHOTOSENSITIVE COMPONENT THEREOF, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE

Title:

CAMERA MODULE, MOULDED PHOTOSENSITIVE COMPONENT THEREOF, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE

Document Type and Number:

WIPO Patent Application WO/2018/145644

Kind Code:

A1

Abstract:

Provided in the present invention are a camera module, a moulded photosensitive component thereof, a manufacturing method therefor, and an electronic device, the moulded photosensitive component comprising a lens, a photosensitive element, a circuit board, a moulded base, and a support element, the photosensitive element being arranged on the circuit board, the moulded base being formed into an integral structure with the lens, the support element, the photosensitive element, and the circuit board by means of a moulding process, and the camera module and the moulded photosensitive component thereof being capable of reducing stain sensitivity and shortening the distance of the lens plane above a light through hole of the lens to the photosensitive plane of the photosensitive element.

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Inventors:

WANG MINGZHU (CN)
LUAN ZHONGYU (CN)
CHEN LIEFENG (CN)
CHENG DUANLIANG (CN)
ZHAO BOJIE (CN)
TANAKA TAKEHIKO (JP)
HUANG ZHEN (CN)

Application Number:

PCT/CN2018/075797

Publication Date:

August 16, 2018

Filing Date:

February 08, 2018

Export Citation:

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Assignee:

NINGBO SUNNY OPOTECH CO LTD (CN)

International Classes:

H04N5/225; G03B17/12; G03B30/00

Foreign References:

CN105721749A	2016-06-29
CN105847645A	2016-08-10
US9529246B2	2016-12-27

Other References: