CAMERA MODULE, AND PHOTOSENSITIVE COMPONENT, ELECTRONIC DEVICE, FORMING MOLD AND MANUFACTURING METHOD THEREOF

WIPO Patent Application WO/2019/047960

A1

A camera module, and a photosensitive component and manufacturing method thereof, the photosensitive component comprising: a circuit board and a photosensitive element, as well as a molded base, the molded base being integrally formed on the circuit board and the photosensitive element, and forming an optical window providing a light path for the photosensitive element; for a portion of the molded base corresponding to a first end side of the molded base near a flexible region, a distance between an outer edge and an inner edge thereof is a; for a portion of the molded base corresponding to an opposite second end side of the molded base distant from the flexible region, a distance between an outer edge and an inner edge thereof is c, wherein 0.2 mm≤a≤1 mm, and 0.2 mm≤c≤1.5a. The dimensions a and c enable a corresponding forming groove in a molding process to fill with mold material, preventing defective products from being formed because of a part not being able to fill with mold material.

JP6065134	An adapter, a camera system, and an adapter control program
JP4950137	Imaging equipment and programs
JP3083934	[Name of device] Digital camera

TANAKA TAKEHIKO (JP)
HUANG ZHEN (CN)
ZHAO BOJIE (CN)
MEI ZHEWEN (CN)

PCT/CN2018/104915

March 14, 2019

September 11, 2018

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NINGBO SUNNY OPOTECH CO LTD (CN)

H04N5/225; B29C45/26

CN207744032U	2018-08-17
CN205961279U	2017-02-15
CN105704354A	2016-06-22
CN105681637A	2016-06-15
CN105681640A	2016-06-15
CN103207502A	2013-07-17
US20040189862A1	2004-09-30

See also references of EP 3684045A4

NINGBO RAYMOND IP AGENCY FIRM (CN)

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