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Patent Searching and Data


Title:
CAMERA MODULE, AND PHOTOSENSITIVE COMPONENT THEREOF AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2017/157211
Kind Code:
A1
Abstract:
A camera module, and a photosensitive component thereof and a manufacturing method therefor. The photosensitive component comprises an encapsulation part and a photosensitive part; the photosensitive part comprises a circuit board main body and a photosensitive chip, and the encapsulation part is integrally encapsulated and formed on the circuit board main body and the photosensitive chip.

Inventors:
WANG MINGZHU (CN)
ZHAO BOJIE (CN)
TANAKA TAKEHIKO (JP)
LUAN ZHONGYU (CN)
CHEN ZHENYU (CN)
HUANG ZHEN (CN)
Application Number:
PCT/CN2017/076041
Publication Date:
September 21, 2017
Filing Date:
March 09, 2017
Export Citation:
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Assignee:
NINGBO SUNNY OPOTECH CO LTD (CN)
International Classes:
H04N5/225; H01L21/60; H01L23/10
Foreign References:
CN105744130A2016-07-06
CN205792874U2016-12-07
CN105704354A2016-06-22
CN205792875U2016-12-07
CN105721754A2016-06-29
CN205545597U2016-08-31
CN105827916A2016-08-03
CN205961266U2017-02-15
CN103700634A2014-04-02
CN1913166A2007-02-14
CN203492103U2014-03-19
US20140071327A12014-03-13
Other References:
See also references of EP 3429183A4
Attorney, Agent or Firm:
NINGBO RAYMOND IP AGENCY FIRM (CN)
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