Title:
CAMERA MODULE AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2006/075381
Kind Code:
A1
Abstract:
One edge part side of a flexible wiring board (10) is bonded to a wiring board (2) of a camera module (1), the flexible wiring board (10) is bent, and the flexible wiring board (10) is bonded to a sealing resin part (9) at a bottom part of the camera module (1). On the flexible wiring board (10), a plurality of wirings (22) composed of a signal line (31) and a GND line (32) are formed, and on the outermost side of the wirings (22), a GND line (32a) having a wide width part (32b) is arranged. In the wide width part (32b), a metal surface is exposed. At the time of mounting the camera module (1) on a mounting board, switching noise generated by the camera module (1) can be led out to a GND terminal side of the mounting board by connecting the wide width part (32b) to the GND terminal of the mounting board.
Inventors:
MOTOI KENICHI (JP)
TOYODA TAKASHI (JP)
TOYODA TAKASHI (JP)
Application Number:
PCT/JP2005/000365
Publication Date:
July 20, 2006
Filing Date:
January 14, 2005
Export Citation:
Assignee:
RENESAS TECH CORP (JP)
MOTOI KENICHI (JP)
TOYODA TAKASHI (JP)
MOTOI KENICHI (JP)
TOYODA TAKASHI (JP)
International Classes:
H05K1/02; H04N5/225
Foreign References:
| JPS535769A | 1978-01-19 | |||
| JP2000068615A | 2000-03-03 | |||
| JPH03224286A | 1991-10-03 |
Attorney, Agent or Firm:
Tsutsui, Yamato (3F Azeria Bldg., 1-1, Nishi-shinjuku 8-chom, Shinjuku-ku Tokyo 23, JP)
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