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Patent Searching and Data


Title:
CAMERA MODULE
Document Type and Number:
WIPO Patent Application WO/2017/188058
Kind Code:
A1
Abstract:
Provided is a camera module with which it is possible for heat inside a case (housing) to be dissipated to the outside efficiently without passing through the case (housing), and with which it is possible to use inexpensive materials for the case (housing). According to the present invention, a camera module which captures images of a subject includes: a heat source; a case in which the heat source is hermetically sealed; a heat conducting plate 92 which is accommodated inside the case and which is in thermal contact with the heat source; a heat conducting bracket, provided outside the case, for attaching the camera module to an attachment body; and a heat transfer member which transfers heat between the heat conducting plate and the heat conducting bracket.

Inventors:
TAMURA KAZUYA (JP)
Application Number:
PCT/JP2017/015574
Publication Date:
November 02, 2017
Filing Date:
April 18, 2017
Export Citation:
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Assignee:
MITSUMI ELECTRIC CO LTD (JP)
International Classes:
G02B7/02; H04N5/225; G03B15/00; G03B17/55; H05K7/20
Foreign References:
JP2001125191A2001-05-11
JP2015022371A2015-02-02
JP2001007552A2001-01-12
JP2002031840A2002-01-31
Attorney, Agent or Firm:
IKEDA, Noriyasu et al. (JP)
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