Title:
CAMERA MODULE
Document Type and Number:
WIPO Patent Application WO/2023/277669
Kind Code:
A1
Abstract:
A camera module comprises: a first body including a first ground part; a second body including a second ground part; a substrate disposed between the first body and the second body and including a hole; and an adhesive bonding the first body and the second body to each other, wherein: the first ground part comes into contact with a first plating layer disposed on one surface of the substrate; the second ground part comes into contact with a second plating layer disposed on the other surface of the substrate; and the first ground part is electrically connected to the second ground part by a connection part connecting the first plating layer to the second plating layer through the hole of the substrate.
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Inventors:
MOON DA HIN (KR)
HAN SANG YEAL (KR)
HAN SANG YEAL (KR)
Application Number:
PCT/KR2022/009562
Publication Date:
January 05, 2023
Filing Date:
July 01, 2022
Export Citation:
Assignee:
LG INNOTEK CO LTD (KR)
International Classes:
H05K1/02; H05K3/42
Foreign References:
| KR20160104316A | 2016-09-05 | |||
| JP2018098660A | 2018-06-21 | |||
| KR20190004457A | 2019-01-14 | |||
| KR20170027073A | 2017-03-09 | |||
| JP2020518859A | 2020-06-25 |
Attorney, Agent or Firm:
JIN, Cheon Woong et al. (KR)
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