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Patent Searching and Data


Title:
CAMERA PACKAGE, CAMERA PACKAGE PRODUCTION METHOD, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/131488
Kind Code:
A1
Abstract:
The present disclosure relates to a camera package that can reduce production costs for forming a lens, a camera package production method, and an electronic device. This camera package production method involves forming a high contact angle film around a lens forming region on the upper side of a transparent substrate that protects a solid-state imaging element, dripping a lens material onto the lens forming region on the upper side of the transparent substrate, and molding the dripped lens material with a mold to form a lens. The invention is applicable, for example, to a camera package having a lens disposed on the upper side of a solid-state imaging element or the like.

Inventors:
MATSUGAI Hiroyasu (4-14-1 Asahi-cho, Atsugi-sh, Kanagawa 14, 〒2430014, JP)
Application Number:
JP2018/047188
Publication Date:
July 04, 2019
Filing Date:
December 21, 2018
Export Citation:
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Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORPORATION (4-14-1, Asahi-cho Atsugi-sh, Kanagawa 14, 〒2430014, JP)
International Classes:
H01L27/146; B29C39/10; G02B3/00; H04N5/369; B29L11/00
Attorney, Agent or Firm:
NISHIKAWA Takashi et al. (Nishishinjuku Prime Square 9F, 5-25 Nishi-Shinjuku 7-chome, Shinjuku-k, Tokyo 23, 〒1600023, JP)
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