CAPACITOR, CONNECTION STRUCTURE, AND METHOD FOR MANUFACTURING CAPACITOR

Title:

CAPACITOR, CONNECTION STRUCTURE, AND METHOD FOR MANUFACTURING CAPACITOR

Document Type and Number:

WIPO Patent Application WO/2021/039053

Kind Code:

A1

Abstract:

This capacitor (20) is provided inside a laminated substrate (10) having an electroconductive pattern (11) on the surface thereof, wherein: the capacitor (20) is provided with a positive electrode part (3) including a first electroconductive metal member (3a) and a porous part (3b) present on the surfaces of the first electroconductive metal member (3a), a negative electrode part (7), and a dielectric layer present between the positive electrode part (3) and the negative electrode part (7); the positive electrode part (3) is drawn out to the surface side of the laminated substrate (10) by a connection electrode (30), the connection electrode (30) having an alloy layer (31) that contains a metal constituting the first electroconductive metal member (3a), and an electroconductive layer (32) provided on the alloy layer (31); and the connection electrode (30) is connected to the electroconductive pattern (11) formed on the surface of the laminated substrate (10).

Inventors:

NAKAMURA KAZUTAKA (JP)
SHIMADA KOHEI (JP)
FURUKAWA TAKESHI (JP)
OTANI SHINJI (JP)
TAKAHASHI AKITOMO (JP)

Application Number:

PCT/JP2020/024179

Publication Date:

March 04, 2021

Filing Date:

June 19, 2020

Export Citation:

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Assignee:

MURATA MANUFACTURING CO (JP)

International Classes:

H01G4/30; H01G9/00; H01G9/052; H01G9/055; H01G9/15

Domestic Patent References:

WO2009001780A1

2008-12-31

Foreign References:

JPS5057942A	1975-05-20
JP2008105087A	2008-05-08
JP2008282835A	2008-11-20
JP2012224897A	2012-11-15
JP2008130722A	2008-06-05