CAPACITOR AND MANUFACTURING METHOD THEREFOR

WIPO Patent Application WO/2022/030210

A1

The purpose of the technology of the present disclosure is to provide a structure for a capacitor that increases the strength of adhesion to a wiring board, for example, and also to suppress an increase in the manufacturing load of the capacitor.　A capacitor main body (4) includes an outer case (12); a sealing member (16) that has first insertion hole sections (24-1, 24-2) and that is attached to the opening of the outer case; and terminal leads (18-1, 18-2) that have a bent section (20) and an exposed terminal section (22). A pedestal (6) is installed on the sealing member side of the capacitor main body and has: second insertion hole sections (26-1, 26-2) through which the terminal leads are inserted; and guide grooves (28-1, 28-2) which are formed on the substrate mounting surface and in which the exposed terminal section is disposed. Resin layers (8-1, 8-2) are disposed between the pedestal and the sealing member, and in a section of the interior of the insertion holes formed by the first insertion hole section and the second insertion hole section. A fixing resin (10) is disposed between the two sides of the exposed terminal section and the edges of the guide grooves, and is formed integrally with the resin layers.

WO/2010/131295	CAPACITOR
JP3220989	[Title of Invention] Electrolytic Capacitor

HASHIMOTO YOUHEI (JP)
NAKATA KOUICHI (JP)
MATSUHIRA KEISUKE (JP)
INOUE RYUUTA (JP)

PCT/JP2021/026566

February 10, 2022

July 15, 2021

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NIPPON CHEMICON (JP)

H01G9/10; H01G2/06; H01G4/228; H01G9/048

WO2018020993A1

2018-02-01

JP2019186245A	2019-10-24
JP2001297943A	2001-10-26
JP2001093780A	2001-04-06

UNEMOTO Shoichi et al. (JP)

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