Title:
CARBON FIBER BUNDLE AND PRODUCTION METHOD FOR SAME
Document Type and Number:
WIPO Patent Application WO/2023/008273
Kind Code:
A1
Abstract:
[Problem] To provide: a carbon fiber bundle that, as a result of specific fluff inside the carbon fiber bundle being suppressed, can suppress catching caused by ring-shaped fluff produced when the carbon fiber bundle is unwound for higher-order processing; and a production method for the carbon fiber bundle. [Solution] A carbon fiber bundle that has an average single fiber diameter B of 6.9–11.0 μm and a resin-impregnated strand tensile elastic modulus E of 230–310 GPa, there being no more than 40 pieces of fluff per m inside the carbon fiber bundle, and the fraction of the fluff inside the carbon fiber bundle that is fluff that has a two-layer cross-section being 1%–25%. It is suitable to obtain the carbon fiber bundle by heat treating a polyacrylonitrile precursor fiber bundle that has a single-fiber fineness of 0.9–2.2 dtex in a 200°C–300°C oxidizing atmosphere to obtain a flame-resistant fiber bundle and then heat treating the flame-resistant fiber bundle at 1,200°C–1,600°C in an inert atmosphere, the heat treatment of the polyacrylonitrile precursor fiber bundle being performed such that the heat generation rate Q on the left side of expression (3) (in which q (J/g/s) is the single-fiber heat generation rate, N (strands) is the filament count, d (dtex) is the single-fiber fineness of the flame-resistant fiber bundle, and W (mm) is the thread width) is 150–500 J/m2/s until the density is 1.22–1.24 g/cm3 and then the heat treatment being continued while the tension of the flame-resistant fiber bundle applies 1.6–4.0 mN/dtex until the density is 1.38–1.50 g/cm3. (3) Q=q×N×d/W/10.
Inventors:
ONO KIMINORI (JP)
SADO YUKI (JP)
TANAKA FUMIHIKO (JP)
MATSUMOTO MASAHIRO (JP)
SADO YUKI (JP)
TANAKA FUMIHIKO (JP)
MATSUMOTO MASAHIRO (JP)
Application Number:
PCT/JP2022/028166
Publication Date:
February 02, 2023
Filing Date:
July 20, 2022
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
D01F9/22; D01F6/18
Domestic Patent References:
| WO2004065434A1 | 2004-08-05 | |||
| WO2013157613A1 | 2013-10-24 |
Foreign References:
| JPH11117123A | 1999-04-27 | |||
| JPH06173120A | 1994-06-21 | |||
| JP2009138313A | 2009-06-25 | |||
| JP2019112730A | 2019-07-11 | |||
| JP2005344254A | 2005-12-15 | |||
| JP2017066580A | 2017-04-06 | |||
| JP2018178344A | 2018-11-15 | |||
| JP2007314901A | 2007-12-06 | |||
| JP2018145541A | 2018-09-20 |
Download PDF:
Previous Patent: INTEGRATED MOLDED BODY AND ELECTRONIC APPARATUS HOUSING
Next Patent: FLEXIBLE STRUCTURE
Next Patent: FLEXIBLE STRUCTURE