Title:
CARBON FIBER SUBSTRATE, PREPREG, POROUS STRUCTURE, METHOD FOR MANUFACTURING SAME, PREFORM, FIBER-REINFORCED RESIN MOLDED BODY, SANDWICH STRUCTURE, AND AIRCRAFT MEMBER
Document Type and Number:
WIPO Patent Application WO/2023/189348
Kind Code:
A1
Abstract:
The objective of the present invention is to obtain a carbon fiber substrate having high levels of both heat resistance and moldability, and to provide a prepreg and a porous structure having high heat resistance by using said carbon fiber substrate. The present invention is a carbon fiber substrate which includes a carbon fiber (A) and a resin composition (B) covering the surface of the carbon fiber (A), wherein the carbon fiber (A) forms a non-woven fabric. The tensile strength of the carbon fiber substrate after heating at 300 °C for 5 minutes is at least 110% of the tensile strength of the carbon fiber substrate before the heating.
Inventors:
IMAI NAOKICHI (JP)
NAKAYAMA YOSHIFUMI (JP)
HONMA MASATO (JP)
NAKAYAMA YOSHIFUMI (JP)
HONMA MASATO (JP)
Application Number:
PCT/JP2023/009036
Publication Date:
October 05, 2023
Filing Date:
March 09, 2023
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
D06M15/59; C08J5/24; D06M101/40
Domestic Patent References:
| WO2010013645A1 | 2010-02-04 | |||
| WO2020137442A1 | 2020-07-02 |
Foreign References:
| US20200123708A1 | 2020-04-23 |
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