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Patent Searching and Data


Title:
CARD CONNECTOR WITH HEAT SINK
Document Type and Number:
WIPO Patent Application WO/2012/110849
Kind Code:
A3
Abstract:
[Problem] To provide a card connector that has a simple structure, is capable of quickly dissipating the heat generated by a card, is small in size, is highly reliable, is inexpensive, and can be manufactured easily. [Solution] The card connector is attached to a substrate and includes: a housing that houses a card provided with terminal members; connection terminals that are attached to the housing and contact the terminal members of the card; and a cover member that is attached to the housing and forms a card housing space between the cover member and the housing. The cover member includes a top panel part, a plurality of side panel parts that stand upright from the side edges of the top panel part, and fixing pieces that extended from the bottom edges of the side panel parts. At least one of the fixing pieces is connected to a heat transfer pad arranged on the substrate. The top panel part contacts the upper surface of the card housed within the card housing space, and is provided with a heat transfer improving part that improves the heat transfer from the card to the top panel part.

Inventors:
NAITO YUJI (JP)
TOMITA MITSUHIRO (JP)
Application Number:
IB2011/003365
Publication Date:
December 06, 2012
Filing Date:
December 06, 2011
Export Citation:
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Assignee:
MOLEX INC (US)
NAITO YUJI (JP)
TOMITA MITSUHIRO (JP)
International Classes:
H01R13/639; G06F1/20; H01R13/64; H05K7/20
Foreign References:
US20020031948A12002-03-14
US20070097625A12007-05-03
Attorney, Agent or Firm:
MORELLA, Timothy, M. (2222 Wellington CourtLisle, IL, US)
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Claims: