Title:
CARGO HANDLING PALLET
Document Type and Number:
WIPO Patent Application WO/2018/020823
Kind Code:
A1
Abstract:
Provided is a cargo handling pallet that improves both loading efficiency and work efficiency. The present invention comprises: a placing surface part that has a rectangular plate-like shape and on which cargo is placed; and a ground contacting surface part that is parallel to the placing surface part and contacts a pallet supporting surface. The present invention is characterized by the following: having a structure in which at least one out of four edge portions of the placing surface part is formed as an eaves-shaped edge portion along the entire or part of the length thereof and a recess is defined below the eaves-shaped edge portion in which the pallet supporting surface is exposed and into which a leading end portion of a fork is inserted; the eaves-shaped edge portion having, in a lower surface thereof, a sliding-contact portion that slidingly contacts an upper surface of the leading end portion of the fork; the depth of the recess being set so as to be greater than a fork insertion length when the upper surface of the leading end portion of the fork first contacts the sliding-contact portion; and a fork insertion gap appearing between the ground contacting surface part and the pallet supporting surface contacting the ground contacting surface part, when the eaves-shaped edge portion is lifted up by the sliding contact between the sliding-contact portion and the upper surface of the leading end portion of the fork.
Inventors:
TSURUTA TAKASHI (JP)
Application Number:
PCT/JP2017/020248
Publication Date:
February 01, 2018
Filing Date:
May 31, 2017
Export Citation:
Assignee:
ADVANCED LOGI-TECH JAPAN CO LTD (JP)
International Classes:
B65D19/22
Foreign References:
| JPS493251U | 1974-01-12 | |||
| JPH06345092A | 1994-12-20 | |||
| JP2001171995A | 2001-06-26 | |||
| JP2006298452A | 2006-11-02 | |||
| JPS6013333Y2 | 1985-04-27 |
Other References:
See also references of EP 3453639A4
Attorney, Agent or Firm:
MITA Daichi et al. (JP)
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