CARRIER-ATTACHED METAL FOIL AND METHOD FOR PRODUCING SAME

WIPO Patent Application WO/2022/124116

A1

Provided is a carrier-attached metal foil which has a metal layer that does not easily peel off at an edge of the carrier-attached metal foil, or at a cut position of the downsized carrier-attached metal foil, and therefore which makes it easy to form an intended circuit pattern, effectively curbs the decrease of strength of the carrier, and is able to be desirably used in a mass-production process. This carrier-attached metal foil comprises: a carrier; a peeling layer attached on the carrier; and a metal layer with a thickness ranging from 0.01 μm to 4.0 μm inclusive, attached on the peeling layer. The carrier has, at least on its surface on the metal layer side, a flat region with a developed interfacial area ratio Sdr of less than 5% measured in accordance with ISO25178, and an uneven region with a developed interfacial area ratio Sdr of 5% to 39% inclusive measured in accordance with ISO25178. The uneven region is formed into a line pattern surrounding the flat region.

NAKAMURA TOSHIMI (JP)
KOMIYA MIKIKO (JP)
MATSUURA YOSHINORI (JP)

PCT/JP2021/043664

June 16, 2022

November 29, 2021

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MITSUI MINING & SMELTING CO LTD (JP)

B24C1/04; B24C5/04; B32B15/04; B32B17/06; H05K1/09; H05K3/00; H05K3/38

WO2019163605A1	2019-08-29
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WO2020075802A1	2020-04-16
WO2019188498A1	2019-10-03
WO2017150283A1	2017-09-08
WO2017150284A1	2017-09-08
WO2014054812A1	2014-04-10
WO2019163605A1	2019-08-29

JP2020139836A	2020-09-03
JP2019207905A	2019-12-05
JP2005076091A	2005-03-24
JP2016137727A	2016-08-04
JP2000331537A	2000-11-30

TAKAMURA Masaharu et al. (JP)

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