Title:
CARRIER-CONTAINING METAL FOIL, AND METHOD FOR MANUFACTURING MILLIMETER-WAVE ANTENNA SUBSTRATE USING SAME
Document Type and Number:
WIPO Patent Application WO/2020/105638
Kind Code:
A1
Abstract:
Provided is a carrier-containing metal foil which has excellent carrier-releasability and excellent selective metal layer-etching properties, and is capable of achieving a reduction in transmission loss and resistance in a semiconductor package (for example, a millimeter-wave antenna substrate) manufactured using same. The carrier-containing metal foil comprises: (a) a carrier; (b) a release functional layer which is disposed on the carrier and includes (b1) an adhesion layer disposed closer to the carrier and having a thickness of more than 10 nm and less than 200 nm, and (b2) a release assistance layer disposed farther from the carrier and having a thickness of 50-500 nm; and (c) a composite metal layer which is disposed on the release functional layer and includes (c1) a carbon layer disposed closer to the release assistance layer, and (c2) a first metal layer disposed farther from the release assistance layer and mainly composed of Au or Pt.
Inventors:
KOMIYA MIKIKO (JP)
YANAI TAKENORI (JP)
ISHII RINTARO (JP)
MATSUURA YOSHINORI (JP)
YANAI TAKENORI (JP)
ISHII RINTARO (JP)
MATSUURA YOSHINORI (JP)
Application Number:
PCT/JP2019/045286
Publication Date:
May 28, 2020
Filing Date:
November 19, 2019
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO (JP)
International Classes:
B32B15/04; H05K1/09
Domestic Patent References:
| WO2017150284A1 | 2017-09-08 | |||
| WO2012133638A1 | 2012-10-04 | |||
| WO2012133637A1 | 2012-10-04 |
Foreign References:
| JP5859155B1 | 2016-02-10 | |||
| JP2007307767A | 2007-11-29 |
Attorney, Agent or Firm:
TAKAMURA Masaharu et al. (JP)
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