Title:
CARRIER FILM FOR ELECTRONIC COMPONENT AND PRODUCTION METHOD FOR CARRIER FILM
Document Type and Number:
WIPO Patent Application WO/2021/006185
Kind Code:
A1
Abstract:
While an electromagnetic shielding film is being formed on an electronic component, equipped with a body that has a bonding face and an external connection terminal disposed on the bonding face, so as to cover the exterior surface of the body, this carrier film for the electronic component is used to protect the bonding face and the external connection terminal, the carrier film being provided with: a first resin layer having a plurality of holes therein; and a second resin layer that is disposed on the first resin layer, that exhibits high aggregability and adhesiveness, and that is capable of undergoing elastic deformation or plastic deformation.
Inventors:
HASHIMOTO HIROKI (JP)
IKEYA TAKUJI (JP)
EBINA NAOKI (JP)
SAKUMA KAZUNORI (JP)
IKEYA TAKUJI (JP)
EBINA NAOKI (JP)
SAKUMA KAZUNORI (JP)
Application Number:
PCT/JP2020/026080
Publication Date:
January 14, 2021
Filing Date:
July 02, 2020
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
B32B5/18; C09J7/26; C09J7/38; C09J201/00; H01L21/50; H01L23/00; H05K9/00
Domestic Patent References:
| WO2019017226A1 | 2019-01-24 | |||
| WO2017033808A1 | 2017-03-02 | |||
| WO2014129480A1 | 2014-08-28 |
Foreign References:
| JP2009503241A | 2009-01-29 | |||
| JP2017054891A | 2017-03-16 | |||
| JP2017536894A | 2017-12-14 |
Other References:
YAMAZAKI, TAKASHI AND TAKANO, Y, HONMA, S.: "Technology to form EMI-shielding film on semiconductor packages using sputter deposition process", TOSHIBA REVIEW, vol. 71, no. 6, December 2016 (2016-12-01), pages 16 - 19, XP055783561
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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