Title:
CARRIER FILM AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2018/194066
Kind Code:
A1
Abstract:
Provided are a carrier film in which, when at least one of a through-hole and a bottomed hole is formed by means of an ultraviolet laser in a sheet member molded on the carrier film, excessive processing in the vicinity of an interface therebetween is suppressed, and a method for manufacturing an electronic component using the carrier film. The carrier film (10) is used for molding a sheet member (20) and, when irradiated with ultraviolet laser (B) with a wavelength distribution having a central wavelength of from 355 nm to 365 nm and including a wavelength of 375 nm or more, has an absorption rate of not less than 50% with respect to components of less than 375 nm in the wavelength distribution of the ultraviolet laser (B) and an absorption rate of less than 50% with respect to components of not less than 375 nm.
Inventors:
YAMAMOTO ISSEI (JP)
ASAI RYOTA (JP)
ASAI RYOTA (JP)
Application Number:
PCT/JP2018/015898
Publication Date:
October 25, 2018
Filing Date:
April 17, 2018
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K3/40; B23K26/382; B23K26/386; B28B1/30; H05K3/00
Foreign References:
| JP2005153358A | 2005-06-16 | |||
| JP2014143221A | 2014-08-07 | |||
| JP2001323075A | 2001-11-20 | |||
| JPH06304774A | 1994-11-01 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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