CARRIER FOIL-ATTACHED ELECTROLYTIC COPPER FOIL PROVIUDED WITH INSULATION LAYER FORMING RESIN LAYER, COPPER-CLAD LAMINATED SHEET, PRINTED CIRCUIT BOARD, PRODUCTION METHOD FOR MULTILAYER COPPER-CLAD LAMINATED SHEET AND PRODUCTION METHOD FOR PRINTED CIRCUIT BOARD

Title:

Document Type and Number:

WIPO Patent Application WO/2005/087489

Kind Code:

A1

Abstract:

A technique of using a copper foil not roughened as a printed circuit board, especially a method using a carrier foil-attached electrolytic copper foil. A carrier foil-attached electrolytic copper foil or the like is used, which is provided with an insulation layer forming resin layer, and which is characterized by being provided on the surface of a carrier foil with a joint interface layer, on the joint interface layer with an electrolytic copper foil layer smooth on the both surfaces thereof, and on the electrolytic copper foil with a resin layer. Resin compositions constituting this resin layer include 20-80 pts.wt. of epoxy resin (including a curing agent), 20-80 pts.wt. of aromatic polyamide resin polymer soluble in a solvent, and a curing accelerator added in a proper amount as needed.

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Inventors:

Nagatani, Seiji c/o MITSUI MINING & SMELTING CO. (LTD. Copper Foil Sector Copper Foil Division 656-2, Kamakurabash, Ageo-shi Saitama 13, 36200, JP)

Application Number:

PCT/JP2005/004501

Publication Date:

September 22, 2005

Filing Date:

March 15, 2005

Export Citation:

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Assignee:

MITSUI MINING & SMELTING CO., LTD. (11-1, Osaki 1-chome Shinagawa-ku Tokyo, 84, 14185, JP)
Nagatani, Seiji c/o MITSUI MINING & SMELTING CO. (LTD. Copper Foil Sector Copper Foil Division 656-2, Kamakurabash, Ageo-shi Saitama 13, 36200, JP)

International Classes:

H05K1/09; B32B15/08; B32B15/088; B32B15/092; H05K1/03; H05K3/00; H05K3/02; H05K3/46; H05K3/42; (IPC1-7): B32B15/08; H05K1/03; H05K1/09; H05K3/00; H05K3/46

Attorney, Agent or Firm:

Yoshimura, Katsuhiro c/o Yoshimura International Patent Office (Omiya F bldg. 5-4, Sakuragicho 2-chome, Omiya-k, Saitama-shi Saitama 54, 33008, JP)

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