CARRIER FOIL-ATTACHED METAL FOIL, MANUFACTURING METHOD THEREFOR, AND LAMINATE COMPRISING SAME

Title:

CARRIER FOIL-ATTACHED METAL FOIL, MANUFACTURING METHOD THEREFOR, AND LAMINATE COMPRISING SAME

Document Type and Number:

WIPO Patent Application WO/2021/107397

Kind Code:

A1

Abstract:

The present invention relates to a carrier foil-attached metal foil including a release layer having a specific composition and structure, a method for manufacturing the carrier foil-attached metal foil, and a laminate for forming a printed circuit board including the carrier foil-attached metal foil. The laminate for forming a printed circuit board according to the present invention comprises the carrier foil-attached metal foil, such that a defect rate can be minimized.

Inventors:

JEON HYUN WOO (KR)
CHUNG BO MOOK (KR)
CHUN SUNG WOOK (KR)

Application Number:

PCT/KR2020/014066

Publication Date:

June 03, 2021

Filing Date:

October 15, 2020

Export Citation:

Click for automatic bibliography generation Help

Assignee:

YMT CO LTD (KR)

International Classes:

C25D5/10; B05D1/18; B32B15/04; B32B15/20; C25D3/56; C25D5/48

Foreign References:

KR20160111985A	2016-09-27
KR20090072423A	2009-07-02
JP2014005545A	2014-01-16
US20030153169A1	2003-08-14
JP2012102407A	2012-05-31
KR102137068B1	2020-07-23

Other References: