CARRIER HEAD FOR CHEMICAL MECHANICAL POLISHING DEVICE, INCLUDING CONTACT FLAP

WIPO Patent Application WO/2018/143530

A1

The present invention relates to a carrier head for a chemical mechanical polishing device, including a contact flap. According to the present invention, the carrier head comprises: a base; a substrate accommodation member connected to the lower part of the base, and having an outer surface, which is a substrate accommodation surface, and an inner surface opposite to the outer surface; at least one contact flap, which has a connecting portion connected, on the inside of the substrate accommodation member, to the lower part of the base, a flap side portion downwardly extended from the connecting portion, and a contact portion extended in the side direction at the lower end of the flap side portion; and at least one barrier structure connected to the lower part of the base, and arranged adjacently to the at least one contact flap, wherein the at least one barrier structure is formed such that the contact portion comes into close contact with the inner surface by fluid pressure by limiting the expansion of the at least one contact flap.

JPS54163682	WASHING DEVICE
JP2003524297	[Title of Invention] An apparatus for processing a substrate
JP7446722	grinding equipment

KANG JOON MO (KR)

PCT/KR2017/009627

August 09, 2018

September 04, 2017

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KANG JOON MO (KR)

H01L21/304; B24B37/32; B24B41/00; H01L21/306; H01L21/321

WO2010132181A2

2010-11-18

KR20140067325A	2014-06-05
KR20050116072A	2005-12-09
KR20080100841A	2008-11-19
JP2015071197A	2015-04-16

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