CARRIER-LAYER-INCLUDED METAL LAMINATE BASE MATERIAL AND METHOD FOR PRODUCING SAME, METAL LAMINATE BASE MATERIAL AND METHOD FOR PRODUCING SAME, AND PRINTED WIRING BOARD

WIPO Patent Application WO/2021/039759

A1

The purpose of the present invention is to provide a carrier-layer-included metal laminate base material in which the high adhesion between an ultra-thin metal layer and a low-dielectric film is secured while maintaining the low adhesion between a carrier layer and the ultra-thin metal layer.　A carrier-layer-included metal laminate base material 1A which comprises a low-dielectric film 20 and a three-layered carrier-layer-included metal foil 10 laminated on one surface of the low-dielectric film 20 and comprising a carrier layer 11, a release layer 12 and an ultra-thin metal layer 13, the carrier-layer-included metal laminate base material 1A being characterized in that the bonding strength between the ultra-thin metal layer 13 and the low-dielectric film 20 is larger than the peel strength between the carrier layer 11 and the ultra-thin metal layer 13.

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NANBU KOJI (JP)
HASHIMOTO YUSUKE (JP)
KUROKAWA TEPPEI (JP)
SADAKI KOTA (JP)
HATAKEDA TAKAFUMI (JP)

PCT/JP2020/031951

March 04, 2021

August 25, 2020

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TOYO KOHAN CO LTD (JP)

C23C28/00; B32B15/08; H05K1/03; H05K1/09

JP2008255462A	2008-10-23
JP2007007937A	2007-01-18
JP2010006071A	2010-01-14
JP2013107323A	2013-06-06

HIRAKI & ASSOCIATES (JP)

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