Title:
CARRIER AND SUBSTRATE MANUFACTURING METHOD USING THIS CARRIER
Document Type and Number:
WIPO Patent Application WO/2017/171052
Kind Code:
A1
Abstract:
[Problem] To provide a carrier which makes it possible to obtain a high-quality substrate at a higher yield than conventional ones and a substrate manufacturing method using this carrier.
[Solution] A carrier 104 according to the present invention is a carrier for polishing or grinding having a holding hole 122 for holding a substrate (for example, a glass substrate 102). The carrier is characterized in that a plurality of protrusions 136 having glass as a main component are present in at least a partial region of at least one surface of the carrier.
Inventors:
PROMCHAI JAKNARIN (TH)
Application Number:
PCT/JP2017/013739
Publication Date:
October 05, 2017
Filing Date:
March 31, 2017
Export Citation:
Assignee:
HOYA CORP (JP)
HOYA GLASS DISK (THAILAND) LTD (TH)
HOYA GLASS DISK (THAILAND) LTD (TH)
International Classes:
B24B37/28; B24B7/17; B24B41/06; G11B5/84; H01L21/304
Foreign References:
| JP2009166228A | 2009-07-30 | |||
| JP2009178806A | 2009-08-13 | |||
| JP2003236742A | 2003-08-26 | |||
| JP2001179615A | 2001-07-03 | |||
| JP2008093746A | 2008-04-24 | |||
| JP2015125788A | 2015-07-06 | |||
| JP2002321151A | 2002-11-05 |
Attorney, Agent or Firm:
AQUA PATENTS, DESIGNS AND TRADEMARKS (JP)
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