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Title:
CARRIER-SUPPORTED COPPER FOIL, PROCESS FOR PRODUCING CARRIER-SUPPORTED COPPER FOIL, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2013/161334
Kind Code:
A1
Abstract:
A carrier-supported copper foil is provided in which the adhesion force between the carrier and the ultrathin copper layer is high before a step for laminating to an insulating substrate and which, after the step for laminating to an insulating substrate, has reduced adhesion between the carrier and the ultrathin copper layer and can be easily separated at the interface between the carrier and the ultrathin copper layer. In the carrier-supported copper foil, pinhole formation in the ultrathin-copper-layer-side surface was satisfactorily inhibited. The carrier-supported copper foil comprises a copper foil carrier, an interlayer superposed on the copper foil carrier, and an ultrathin copper layer superposed on the interlayer. The interlayer is configured of a nickel layer and a chromate layer which have been superposed in this order on the copper foil carrier, and the interlayer has a nickel deposition amount of 100-40,000 µg/dm2 and a chromium deposition amount of 5-100 µg/dm2. When a cross-section of the copper foil carrier/interlayer/ultrathin copper layer is examined by STEM line analysis over a length of 50-1,000 nm which includes all of the layers, the maximum of the nickel concentration is 40-95 mass% and the minimum of the copper concentration in the part where nickel is coexistent with copper is 1-50 mass%.

Inventors:
CHUGANJI MISATO (JP)
NAGAURA TOMOTA (JP)
Application Number:
PCT/JP2013/051353
Publication Date:
October 31, 2013
Filing Date:
January 23, 2013
Export Citation:
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Assignee:
JX NIPPON MINING & METALS CORP (JP)
International Classes:
C25D1/04; C23C28/00; C25D7/06
Domestic Patent References:
WO2013031913A12013-03-07
Foreign References:
JP2007007937A2007-01-18
JP2005076091A2005-03-24
JP2004169181A2004-06-17
JP2002292788A2002-10-09
JPS5720347A1982-02-02
US0454381A1891-06-16
Attorney, Agent or Firm:
AXIS Patent International (JP)
Axis international patent business corporation (JP)
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