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Title:
CARRIER TAPE FOR RECEIVING ELECTRONIC COMPONENTS, METHOD FOR MANUFACTURING CARRIER TAPE FOR RECEIVING ELECTRONIC COMPONENTS, AND PACKAGE BODY
Document Type and Number:
WIPO Patent Application WO/2013/146593
Kind Code:
A1
Abstract:
The present invention provides a carrier tape for receiving electronic components. The carrier tape is a resin carrier tape having a band-like sheet and also having recesses disposed along the longitudinal direction of the band-like sheet. The recesses are formed in a first surface of the band-like sheet, and a second surface on the reverse side of the first surface is substantially flat. The edges of the recesses are curved at a radius of 0.2 mm or less. The present invention also provides: a method for manufacturing the carrier tape for receiving electronic components; and a package body.

Inventors:
OKOCHI EIJI (JP)
TAJIRI KAZUO (JP)
NAKAGOSHI KENICHI (JP)
SUGIYAMA TOSHIO (JP)
Application Number:
PCT/JP2013/058313
Publication Date:
October 03, 2013
Filing Date:
March 22, 2013
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
B65D73/02; B29C48/08; B29C48/305; B29C59/04; B65B15/04; B65D85/86
Foreign References:
JP2000185766A2000-07-04
JP2011225256A2011-11-10
JP2006117250A2006-05-11
JP2004137080A2004-05-13
JPH08132515A1996-05-28
US3465874A1969-09-09
JPS5723920Y21982-05-24
JP2001240122A2001-09-04
JP2004331171A2004-11-25
JP2008528390A2008-07-31
Attorney, Agent or Firm:
ASAHI, Kazuo et al. (JP)
Morning ratio One husband (JP)
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