Title:
CARRIERS FOR POLISHING, MANUFACTURING METHOD FOR CARRIERS FOR POLISHING, AND MAGNETIC DISC SUBSTRATE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2015/080295
Kind Code:
A1
Abstract:
A carrier for polishing is formed from a composite material containing fibers oriented at least in one direction and resin material, and has a retaining hole for retaining a disc-shaped substrate when polishing a pair of main surfaces of the substrate by sandwiching the substrate with a top surface plate and a bottom surface plate. The retaining hole has, on the periphery of an inner circumferential wall face of the retaining hole: a first wall that is configured so that the substrate contacts the fibers in a state where the substrate is retained in the retaining hole; and a second wall that is configured so that the substrate does not contact the fibers. The second wall is formed in a portion of the inner circumferential wall face that faces in the direction, which includes the one direction, of fiber orientation.
Inventors:
TAMAKI MASANORI (JP)
NAKAGAWA HIROKI (JP)
NAKAGAWA HIROKI (JP)
Application Number:
PCT/JP2014/081800
Publication Date:
June 04, 2015
Filing Date:
December 01, 2014
Export Citation:
Assignee:
HOYA CORP (JP)
International Classes:
B24B37/28
Foreign References:
| JP2008044083A | 2008-02-28 | |||
| JP2001138221A | 2001-05-22 | |||
| JP2000301451A | 2000-10-31 | |||
| JP2002326156A | 2002-11-12 | |||
| JPH11309665A | 1999-11-09 |
Attorney, Agent or Firm:
GLOBAL IP TOKYO (JP)
Global IP Tokyo patent business corporation (JP)
Global IP Tokyo patent business corporation (JP)
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