Title:
CASE MOLD TYPE CAPACITOR
Document Type and Number:
WIPO Patent Application WO/2010/067514
Kind Code:
A1
Abstract:
A case mold type capacitor includes a first capacitor element connected in parallel to a second and a third capacitor element and resin-molded. One of the lead-out electrodes of the first capacitor element is connected to a first main bus bar while the other lead-out electrode is connected to a second main bus bar. One of the lead-out electrodes of the second capacitor element is connected to the first main bus bar while the other lead-out electrode is connected to one end of a first sub bus bar. One of the lead-out electrodes of the third capacitor element is connected to the second main bus bar while the other lead-out electrode is connected to one end of a second sub bus bar. The other end of the first sub bus bar and the other end of the second sub bus bar are superposed on each other out of the mold resin.
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Inventors:
HASHIBA, Yusuke (())
橋場裕介 (())
橋場裕介 (())
Application Number:
JP2009/006002
Publication Date:
June 17, 2010
Filing Date:
November 11, 2009
Export Citation:
Assignee:
PANASONIC CORPORATION (1006, Oaza Kadoma Kadoma-sh, Osaka 01, 〒5718501, JP)
パナソニック株式会社 (〒01 大阪府門真市大字門真１００６番地 Osaka, 〒5718501, JP)
HASHIBA, Yusuke (())
パナソニック株式会社 (〒01 大阪府門真市大字門真１００６番地 Osaka, 〒5718501, JP)
HASHIBA, Yusuke (())
International Classes:
H01G4/228; H01G2/04; H01G4/224; H01G4/38
Attorney, Agent or Firm:
NAITO, Hiroki et al. (1006 Oaza Kadoma, Kadoma-sh, Osaka 01, 〒5718501, JP)
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