Title:
CASE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING CASE
Document Type and Number:
WIPO Patent Application WO/2017/163638
Kind Code:
A1
Abstract:
Fixing a case body and a lid member to each other using adhesive requires the steps of applying adhesive, bonding the case body and the lid member to each other, and curing the adhesive by heating or the like, requiring much time and effort to manufacture a device. Fixing a case body and a lid member to each other using engaging hooks also requires much time and effort to manufacture a device due to the need to form the fine shape of the engaging hooks. A case is provided with a first member and a second member which engages with the first member to form an internal accommodating space, the first member extending from the first member side toward the second member side, wherein the case includes a protrusion portion having an end portion which is crushed from an opposite side from the first member so as to fix the second member to the first member. A semiconductor device provided with the case is also provided.
Inventors:
MARUYAMA RIKIHIRO (JP)
Application Number:
PCT/JP2017/004460
Publication Date:
September 28, 2017
Filing Date:
February 07, 2017
Export Citation:
Assignee:
FUJI ELECTRIC CO LTD (JP)
International Classes:
H05K5/00; H01L23/02; H01L23/28; H05K5/03
Foreign References:
| JPH04359547A | 1992-12-11 | |||
| JP2010521823A | 2010-06-24 | |||
| JP2005340700A | 2005-12-08 | |||
| JP2005251320A | 2005-09-15 |
Attorney, Agent or Firm:
RYUKA IP LAW FIRM (JP)
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