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Patent Searching and Data


Title:
CASING MATERIAL FOR PILLOW PACKAGING AND PILLOW PACKAGE
Document Type and Number:
WIPO Patent Application WO/2011/096333
Kind Code:
A1
Abstract:
Disclosed is a casing material (1) formed by superposing an adhesive layer (12) comprising CPP as a main component on one surface of a biaxially stretched nylon film (11) and superposing a protective layer (13) on the other surface of the biaxially stretched nylon film (11), the protective layer (13) being formed from a specific resin, e.g., PVDC. The adhesive layer (12) can hence have heightened sealing strength, and an improvement in strength including impact resistance can be attained. Consequently, a high-strength pillow package which is easy to open is obtained by forming the adhesion parts of the pillow package by means of the adhesive layer (12), without requiring the use of metallic clips. Since the protective layer (13) was formed using a specific resin, e.g., a PVDC resin, the protective layer (13) has excellent heat resistance and strength. Therefore, the protective layer (13) can protect the biaxially stretched nylon film (11) during retortion with high-temperature water, and the package can be prevented from suffering breakage or the like.

Inventors:
TAKASHIGE Masao (26-2, Shinkawa 1-chome Chuo-k, Tokyo 33, 〒1040033, JP)
Application Number:
JP2011/051743
Publication Date:
August 11, 2011
Filing Date:
January 28, 2011
Export Citation:
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Assignee:
IDEMITSU UNITECH CO.,LTD. (26-2, Shinkawa 1-chome Chuo-k, Tokyo 33, 〒1040033, JP)
出光ユニテック株式会社 (〒33 東京都中央区新川一丁目26番2号 Tokyo, 〒1040033, JP)
International Classes:
B65D65/40; A22C13/00; B65D33/00; B65D33/22; B65D85/50
Attorney, Agent or Firm:
KINOSHITA & ASSOCIATES (3rd floor, Ogikubo TM building 26-13, Ogikubo 5-chome, Suginami-k, Tokyo 51, 〒1670051, JP)
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Claims: