CATALYTIC REACTIVE PAD FOR METAL CMP - CABOT MICROELECTRONICS CORP

Title:

CATALYTIC REACTIVE PAD FOR METAL CMP

Document Type and Number:

WIPO Patent Application WO2002057071

Kind Code:

A3

Abstract:

A polishing pad including a polishing pad substrate and a catalyst having multiple oxidation states wherein the catalyst containing polishing pad is used in conjunction with an oxidizing agent to chemically mechanically polish metal features associated with integrated circuits and other electronic devices.

Inventors:

GRUMBINE STEVEN K
STREINZ CHRISTOPHER C
MUELLER BRIAN L

Application Number:

PCT/US2002/001476

Publication Date:

November 21, 2002

Filing Date:

January 18, 2002

Export Citation:

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Assignee:

CABOT MICROELECTRONICS CORP (US)

International Classes:

B24B37/24; B24D3/34; B24D13/14; C09K3/14; H01L21/304; (IPC1-7): B24B37/04; B24D3/34; B24D13/14; C23F3/06; C09G1/02; H01L21/321

Foreign References:

US5948697A	1999-09-07
EP0844290A1	1998-05-27

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