Title:
CATIONICALLY CURABLE ADHESIVE COMPOSITION FOR CAMERA MODULES, CURED PRODUCT, AND ASSEMBLY
Document Type and Number:
WIPO Patent Application WO/2018/092463
Kind Code:
A1
Abstract:
[Problem] To provide a cationically curable adhesive composition that combines low-temperature curability with adhesiveness to engineering plastics (in particular, LCPs). [Solution] A cationically curable adhesive composition for camera modules, characterized by comprising: an (A) component that is a cationically polymerizable resin comprising at least one selected from the group consisting of alicyclic epoxy resins and hydrogenated epoxy resins; a (B) component that is a thermal cationic polymerization initiator; and a (C) component that is a rubber filler and/or a styrene filler, said rubber filler comprising at least one selected from the group consisting of diene rubbers and (meth)acrylic rubbers (excluding silicone/acrylic copolymers).
Inventors:
MATSUOKA HIROTO (JP)
Application Number:
PCT/JP2017/036518
Publication Date:
May 24, 2018
Filing Date:
October 06, 2017
Export Citation:
Assignee:
THREE BOND CO LTD (JP)
International Classes:
C09J163/00; C09J11/06; C09J11/08; G02B7/02
Domestic Patent References:
| WO2014034507A1 | 2014-03-06 |
Foreign References:
| JP2011111556A | 2011-06-09 | |||
| JP2009249569A | 2009-10-29 | |||
| JP2004346247A | 2004-12-09 | |||
| JP2016021033A | 2016-02-04 |
Attorney, Agent or Firm:
HATTA & ASSOCIATES (JP)
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