Title:
CATIONICALLY CURING EPOXY RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2005/059002
Kind Code:
A1
Abstract:
Disclosed is a cationically photocuring epoxy resin composition containing (a) an epoxy resin component, (b) a photocationic initiator, (c) a thermocationic initiator and (d) a filler selected from the group consisting of oxides, hydroxides and carbonates containing an element belonging to group II of the long periodic table. This composition is especially excellent in adhesion to glasses and also excellent in reflow resistant characteristics, moisture resistance and water resistance while essentially having good workability of a photocuring resin.
Inventors:
CHEN CHUNFU (JP)
GAN YOKE AI (JP)
GAN YOKE AI (JP)
Application Number:
PCT/JP2004/018790
Publication Date:
June 30, 2005
Filing Date:
December 16, 2004
Export Citation:
Assignee:
HENKEL CORP (US)
CHEN CHUNFU (JP)
GAN YOKE AI (JP)
CHEN CHUNFU (JP)
GAN YOKE AI (JP)
International Classes:
C08G59/18; C08G59/68; (IPC1-7): C08G59/68
Foreign References:
| JPH0980251A | 1997-03-28 | |||
| JPH05171084A | 1993-07-09 | |||
| JP2003327785A | 2003-11-19 | |||
| JPH10101904A | 1998-04-21 | |||
| JP2001261780A | 2001-09-26 | |||
| JPH11116659A | 1999-04-27 |
Attorney, Agent or Firm:
Ito, Katsuhiro (3-11-8 Hacchobor, Chuou-ku Tokyo, JP)
Download PDF:
Previous Patent: CATALYST AND METHOD OF MAKING POLYURETHANE MATERIALS
Next Patent: BIODEGRADABLE AROMATIC POLYESTER AND MOLDING THEREOF
Next Patent: BIODEGRADABLE AROMATIC POLYESTER AND MOLDING THEREOF