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Title:
CAVITY SHAPES FOR PLASMA-ASSISTED PROCESSING
Document Type and Number:
WIPO Patent Application WO2003096383
Kind Code:
A3
Abstract:
Methods and apparatus for selectively processing objects with a plasma formed in a cavity (12) with electromagnetic radiation. In one embodiment, a method can be provided that includes placing the object in the cavity (12) such that a first gap (525) is formed, having a thickness less than about lambda/4, between a first surface region (510) of the object and the inner surface of the cavity, and a second gap (526) is formed, having a thickness at least about lambda /4, between a second surface region (520) and the inner surface, introducing gas into the cavity; and irradiating the cavity with the radiation to form a plasma in the second gap but not in the first gap.

Inventors:
KUMAR SATYENDRA (US)
KUMAR DEVENDRA (US)
Application Number:
US0314137W
Publication Date:
July 22, 2004
Filing Date:
May 07, 2003
Export Citation:
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Assignee:
DANA CORPORATION
KUMAR, SATYENDRA
KUMAR, DEVENDRA
International Classes:
B01J7/00; A62D3/00; B01D53/86; B01D53/92; B01J19/08; B01J19/12; B01J37/34; B22F3/105; C01B3/02; C21D1/06; C21D1/09; C21D1/38; F01N3/08; F01N3/10; F01N3/20; F01N3/24; F01N3/28; F01N3/30; F01N9/00; F27B17/00; F27D3/12; F27D11/08; F27D11/12; G21K5/00; H01J37/32; H01M8/06; H05B6/68; H05B6/78; H05B6/80; H05H1/24; H05H1/46; C22B4/00; F01N13/10; (IPC1-7): B23K9/00
Foreign References:
JPH08217558A1996-08-27
US4877589A1989-10-31
EP0435591A21991-07-03
US5224117A1993-06-29
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