CAVITY STRUCTURE OF SEMICONDUCTOR PACKAGE MOLD CAPABLE OF VACUUM ADSORPTION OF LEAD FRAME

WIPO Patent Application WO/2019/105063

A1

A cavity structure of a semiconductor package mold capable of vacuum adsorption of a lead frame. A vacuum adsorption platform (1) is provided in the middle area of the upper surface of the cavity; a plurality of adsorption areas are provided on the vacuum adsorption platform (1) according to the positions of chip package units on a lead frame, and a plurality of blind adsorption holes (2) are distributed in each adsorption area; a vacuum passage (3) communicated with the plurality of adsorption holes (2) is provided in the vacuum adsorption platform (1), and the vacuum passage (3) has an external port (4) communicated with a side face of the cavity; a plurality of vacuum air pores (5) are provided at the periphery of the upper surface of the cavity at intervals, and the bottoms of the vacuum air pores (5) are communicated with each other and are communicated with the vacuum passage (3) by means of air passages (7); a long side edge of the upper surface of the cavity is provided with a plurality of vacuum air grooves (8) at intervals that are parallel to each other and are semi-circular grooves, and the outer ends of the vacuum air grooves (8) are communicated with a side face of the cavity.

GU XIAN (CN)
LIANG XIAOLONG (CN)
CHEN SHIBIN (CN)

PCT/CN2018/099968

June 06, 2019

August 10, 2018

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NANTONG SAMER PREC EQUIPMENT CO LTD (CN)

B29C33/10; H01L21/56; B29L31/34

CN1481003A	2004-03-10
CN205572905U	2016-09-14
CN1204144A	1999-01-06
CN1638071A	2005-07-13
CN204760367U	2015-11-11
JP2011014606A	2011-01-20

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