Title:
CERAMIC BONDED BODY
Document Type and Number:
WIPO Patent Application WO/2017/057470
Kind Code:
A1
Abstract:
This ceramic bonded body comprises: a first silicon carbide ceramic; a second silicon carbide ceramic; and a bonding layer located between the first silicon carbide ceramic and the second silicon carbide ceramic. The bonding layer includes, out of 100 mass% of all of the components constituting the bonding layer, 25 mass% or more of metallic silicon, 25 mass% or more of silicon carbide, and a total of 75 mass% or more of metallic silicon and silicon carbide, and further includes at least nickel silicide or chromium silicide.
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Inventors:
NAKAMURA KIYOTAKA (JP)
MORIYAMA MASAYUKI (JP)
MORIYAMA MASAYUKI (JP)
Application Number:
PCT/JP2016/078641
Publication Date:
April 06, 2017
Filing Date:
September 28, 2016
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
C04B37/00
Domestic Patent References:
WO2014133068A1 | 2014-09-04 |
Foreign References:
JP2014198650A | 2014-10-23 | |||
JP2013522154A | 2013-06-13 |
Other References:
See also references of EP 3357896A4
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