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Patent Searching and Data


Title:
CERAMIC CIRCUIT BOARD FOR DUAL-SIDE COOLING POWER MODULE, METHOD FOR PREPARING SAME, AND DUAL-SIDE COOLING POWER MODULE HAVING SAME
Document Type and Number:
WIPO Patent Application WO/2022/045694
Kind Code:
A1
Abstract:
The present invention relates to a ceramic circuit board and, more specifically, to a ceramic circuit board used as a substrate in a dual-side cooling power module. The present invention provides a method for preparing a ceramic circuit board for a dual-side cooling power module comprising the steps of: a) preparing a ceramic substrate having a first surface and a second surface positioned alongside the first surface; b) forming a stepped three-dimensional copper pattern on the first surface, wherein the step b) comprises the steps of: b-1) forming a base copper layer on the first surface of the ceramic substrate; and b-2) forming a copper paste layer by printing and drying a copper paste on one part of the base copper layer, and forming at least one copper layer by pressing the copper paste layer to reduce the height difference of the copper paste layer and then heat treating same, thereby forming a first stepped copper structure protruding from the base copper layer. The method for preparing a ceramic circuit board for a dual-side cooling power module according to the present invention has the advantage of forming a three-dimensional pattern on a ceramic substrate so as to correspond to semiconductor devices in various forms which are mounted on the substrate.

Inventors:
KIM MIN SOO (KR)
BAE IL SEOK (KR)
PARK JIN SU (KR)
Application Number:
PCT/KR2021/011178
Publication Date:
March 03, 2022
Filing Date:
August 23, 2021
Export Citation:
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Assignee:
COMET NETWORK CO LTD (KR)
International Classes:
H05K1/03; H01L23/373; H05K1/09; H05K3/12
Foreign References:
JP2007201346A2007-08-09
KR102048478B12019-11-25
JP5677585B22015-02-25
JP6346518B22018-06-20
JP6096094B22017-03-15
Attorney, Agent or Firm:
DYNE PATENT & LAW FIRM (KR)
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