Title:
CERAMIC CIRCUIT BOARD AND METHOD FOR MANUFACTURING CERAMIC CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2017/213207
Kind Code:
A1
Abstract:
A ceramic circuit board according to the present invention is provided with: a ceramic substrate; a copper circuit that is made of a copper-based material and joined to one surface of the ceramic substrate via a joint layer; and a copper heat-radiating plate that is made of a copper-based material and joined to the other surface of the ceramic substrate via the joint layer. The joint layer is provided with: a brazing material component comprising two or more types of metals such as Ag; and an active metal of a prescribed concentration. The joint layer is provided with: a brazing material layer comprising a brazing material component; and an active metal compound layer including an active metal, wherein the proportion of the joining area of the active metal compound layer with respect to the joining area of the joint layer is 88% or higher.
Inventors:
KISHIMOTO TAKAOMI (JP)
Application Number:
PCT/JP2017/021247
Publication Date:
December 14, 2017
Filing Date:
June 08, 2017
Export Citation:
Assignee:
TANAKA PRECIOUS METAL IND (JP)
International Classes:
H05K1/03; B23K35/30; C04B37/02; C22C5/06; H01L23/12; H05K1/02; H05K3/38
Domestic Patent References:
| WO2011034075A1 | 2011-03-24 |
Foreign References:
| JP2014090144A | 2014-05-15 | |||
| JPH05267529A | 1993-10-15 |
Other References:
See also references of EP 3471517A4
Attorney, Agent or Firm:
TANAKA AND OKAZAKI (JP)
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