Title:
CERAMIC CIRCUIT BOARD AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2019/022133
Kind Code:
A1
Abstract:
[Problem] To provide a ceramic circuit board that has high bonding ability and superior thermal cycle resistance. [Solution] According to the present invention, a circuit pattern is provided on a ceramic substrate via a brazing layer, and an extrusion part is formed by the brazing layer running over the outer edge of the circuit pattern. The brazing layer includes Ag, Cu, and Ti, and also includes Sn or In. A Ag-rich phase is formed continuously for at least a distance of 300 μm from the outer edge of the extrusion part inward along a bonding interface between the ceramic substrate and the circuit pattern. The ceramic circuit board thus produced has a bonding void ratio of at most 1.0%.
Inventors:
YUASA AKIMASA (JP)
HARADA YUSAKU (JP)
NAKAMURA TAKAHIRO (JP)
MORITA SHUHEI (JP)
NISHIMURA KOUJI (JP)
HARADA YUSAKU (JP)
NAKAMURA TAKAHIRO (JP)
MORITA SHUHEI (JP)
NISHIMURA KOUJI (JP)
Application Number:
PCT/JP2018/027882
Publication Date:
January 31, 2019
Filing Date:
July 25, 2018
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
H05K1/09; B23K1/00; B23K1/19; B23K35/30; C22C5/06; H01L23/13; H05K1/03; H05K3/38
Domestic Patent References:
| WO2017056360A1 | 2017-04-06 |
Foreign References:
| JP2016165001A | 2016-09-08 | |||
| JP2009256207A | 2009-11-05 | |||
| JP2005268821A | 2005-09-29 | |||
| JP2003112980A | 2003-04-18 | |||
| JP2005268821A | 2005-09-29 |
Other References:
See also references of EP 3661337A4
Attorney, Agent or Firm:
SONODA & KOBAYASHI INTELLECTUAL PROPERTY LAW (JP)
Download PDF: