Title:
CERAMIC COPPER-METALLIZED WIRING BOARD AND PROCESS FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2014/084077
Kind Code:
A1
Abstract:
The present invention pertains to a process for producing a ceramic copper-metallized wiring board, said process including: forming a film which comprises 150 to 250 zinc oxide needle crystals per μm2 on a ceramic base material by a wet method of immersing the ceramic base material in a zinc plating liquid, said zinc oxide needle crystals having a diameter of 20 to 100nm and a length of 120 to 280nm; heat-treating the resulting ceramic base material in the atmosphere at a temperature of 500 to lower than 900º; forming a copper deposit by electroless copper plating or copper electroplating; and subjecting the copper deposit to patterning with an etching resist to form a wiring pattern. According to the process, a ceramic copper-metallized wiring board which exhibit excellent adhesion and which is usable as a wiring board for a power module can be obtained.
Inventors:
NAGASE AYUMI (JP)
KAMEI HIROSHI (JP)
KIDANI NAOKI (JP)
AOKI MAKOTO (JP)
SHINAGAWA TSUTOMU (JP)
KAMEI HIROSHI (JP)
KIDANI NAOKI (JP)
AOKI MAKOTO (JP)
SHINAGAWA TSUTOMU (JP)
Application Number:
PCT/JP2013/081005
Publication Date:
June 05, 2014
Filing Date:
November 18, 2013
Export Citation:
Assignee:
NIKKO KK (JP)
OSAKA MUNICIPAL TECHNICAL RESEACH INST (JP)
OSAKA MUNICIPAL TECHNICAL RESEACH INST (JP)
International Classes:
C23C18/18; C23C18/38; C23C28/00; H05K3/18
Foreign References:
| JP2007126743A | 2007-05-24 | |||
| JP2002141639A | 2002-05-17 |
Attorney, Agent or Firm:
OHIE Kunihisa et al. (JP)
Landlord Kunihisa (JP)
Landlord Kunihisa (JP)
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