Title:
CERAMIC ELECTRONIC PART
Document Type and Number:
WIPO Patent Application WO/2014/162854
Kind Code:
A1
Abstract:
[Problem] To provide a ceramic electronic part capable of, even if the warp of a substrate on which the ceramic electronic part is mounted occurs due to, for example, a thermal shock, preventing the stress caused by this warp from being transmitted to a ceramic chip. [Solution] An external electrode (12) of a capacitor (10) has: one first planar portion (SEa) positioned on the surface that defines the length dimension of a ceramic chip (11) and having a substantially rectangular outline; and four second planar portions (SEb) positioned on both surfaces that define the height dimension of the ceramic chip (11) and on both surfaces that define the width dimension thereof and having a substantially rectangular outline continuing to the first planar portion (SEa). The second planar portions (SEb) are constituted by a printed metal film (12a) formed on an outer surface of the ceramic chip (11) and a plated metal film (12b) formed through an adhesion relaxation film (12c) on an outer surface of the printed metal film (12a).
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| JP2011216633 | ELECTRONIC COMPONENT |
Inventors:
OTSUKA KOJI (JP)
NAKAMURA TOSHIAKI (JP)
NAKAMURA TOSHIAKI (JP)
Application Number:
PCT/JP2014/057053
Publication Date:
October 09, 2014
Filing Date:
March 17, 2014
Export Citation:
Assignee:
TAIYO YUDEN KK (JP)
International Classes:
H01G4/252; H01G4/232; H01G4/30
Foreign References:
| JPH0888138A | 1996-04-02 | |||
| JPH11162771A | 1999-06-18 | |||
| JP2012094585A | 2012-05-17 | |||
| JP2014027085A | 2014-02-06 |
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