CERAMIC MULTILAYER SUBSTRATE MANUFACTURING METHOD AND UNFIRED COMPOSITE MULTILAYER BODY

WIPO Patent Application WO/2003/072325

A1

By interposing an unfired multilayer multi-substrate (13) mainly containing a low-temperature firing glass ceramic powder between first and second shrinkage control layers (14a, 14b) mainly containing an aluminum powder, an unfired composite multilayer body (11) is prepared. A cut groove (16) is formed in a major surface (11a) of the unfired composite multilayer body (11) to a depth penetrating through the shrinkage control layer (14a) and the unfired multilayer multi-substrate (13), reaching the other shrinkage control layer (14b), and not reaching the other major surface (11b). The unfired composite multilayer body (11) with the cut groove (16) is fired under the firing condition of the low-temperature firing glass ceramic powder, the unfired shrinkage control layers (14a, 14b) are removed, and ceramic multilayer substrates are produced. Thus, high-precision ceramic multilayer substrates can be produced, causing few division failures when dividing a multilayer multi-substrate into ceramic multilayer substrates.

KAWAKAMI HIROMICHI (JP)
SAITO YOSHIFUMI (JP)

PCT/JP2003/000641

September 04, 2003

January 24, 2003

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MURATA MANUFACTURING CO (JP)
KAWAKAMI HIROMICHI (JP)
SAITO YOSHIFUMI (JP)

C04B35/64; B28B11/00; B28B11/12; B28B11/24; H01L21/48; H01L23/12; H01L23/15; H01L23/498; H05K1/03; H05K3/00; H05K3/46; (IPC1-7): B28B11/14; C04B35/64; H01L23/12; H05K3/00; H05K3/46

EP1178714A2	2002-02-06
JPH0384993A	1991-04-10
JPS60169126A	1985-09-02
EP0479219A1	1992-04-08
EP0535711A2	1993-04-07
JPH0528867A	1993-02-05
JPH06283861A	1994-10-07
JPH0799263A	1995-04-11
JPH06270122A	1994-09-27

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