Title:
CERAMIC MULTILAYER SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2006/051916
Kind Code:
A1
Abstract:
Disclosed is a highly reliable ceramic multilayer substrate comprising a terminal electrode which has high coupling strength (connection strength) with a ceramic multilayer body constituting the ceramic multilayer substrate while being improved in bonding strength with a bonding material such as a solder that is used for mounting the ceramic multilayer substrate onto a mounting substrate. Specifically disclosed is a ceramic multilayer substrate (A) comprising a ceramic multilayer body (10), a circuit element (44) arranged inside the ceramic multilayer body (10), and a terminal electrode (11) which is formed on a first major surface (10a), which is arranged opposite to a mounting substrate (21) when the ceramic multilayer body is mounted thereon, and connected to a land electrode (16) on the mounting substrate via a solder (14) as the bonding material. In this ceramic multilayer substrate (A), the terminal electrode (11) is formed to have recesses and projections in an outer periphery (11a) when viewed in plan. In addition, the terminal electrode (11) is composed of a via hole conductor arranged inside the ceramic multilayer body. Alternatively, the terminal electrode (11) is composed of a stud conductor which is so arranged as to protrude from the first major surface of the ceramic multilayer body.
Inventors:
CHIKAGAWA OSAMU (JP)
Application Number:
PCT/JP2005/020745
Publication Date:
May 18, 2006
Filing Date:
November 11, 2005
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
CHIKAGAWA OSAMU (JP)
CHIKAGAWA OSAMU (JP)
International Classes:
H05K3/46
Foreign References:
| JPH07202422A | 1995-08-04 | |||
| JP2003133473A | 2003-05-09 | |||
| JP2002076047A | 2002-03-15 | |||
| JP2003007910A | 2003-01-10 |
Attorney, Agent or Firm:
Nishizawa, Hitoshi (Daido Seimei Minami-kan 1-2-11 Edobori, Nishi-k, Osaka-shi Osaka 02, JP)
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