Title:
CERAMIC RESIN COMPOSITE BODY
Document Type and Number:
WIPO Patent Application WO/2017/155110
Kind Code:
A1
Abstract:
Provided is a ceramic resin composite body which has excellent mass productivity and product characteristics (heat dissipation properties, insulation properties and adhesion properties), and which is especially capable of dramatically improving the heat dissipation properties of an electronic device. A ceramic resin composite body which is obtained by impregnating 35-70% by volume of a sintered body, in which non-oxide ceramic primary particles having an average length of 3-60 μm and an aspect ratio of 5-30 are three-dimensionally connected to form an integrated structure, with 65-30% by volume of a thermosetting resin composition which has a number average molecular weight of 450-4,800, an onset temperature of 180°C or higher as measured by a differential scanning calorimeter, and a curing ratio of 5-60%.
More Like This:
Inventors:
NISHI TAIKI (JP)
HIROTSURU HIDEKI (JP)
MITSUNAGA TOSHIKATSU (JP)
INOUE SAORI (JP)
HIROTSURU HIDEKI (JP)
MITSUNAGA TOSHIKATSU (JP)
INOUE SAORI (JP)
Application Number:
PCT/JP2017/009791
Publication Date:
September 14, 2017
Filing Date:
March 10, 2017
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
B32B15/08; C08J5/24; B32B27/20; C04B41/83; H05K1/03; H05K1/05; H05K3/46; C08L101/00
Domestic Patent References:
| WO2015022956A1 | 2015-02-19 |
Foreign References:
| JPH10100320A | 1998-04-21 | |||
| JPH10308565A | 1998-11-17 | |||
| JP2015124122A | 2015-07-06 | |||
| JP2016111171A | 2016-06-20 |
Other References:
See also references of EP 3428223A4
Attorney, Agent or Firm:
AXIS PATENT INTERNATIONAL (JP)
Download PDF: