Title:
CERAMIC SUBSTRATE MANUFACTURING METHOD AND CERAMIC SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2008/029847
Kind Code:
A1
Abstract:
A method for manufacturing a ceramic substrate having a via hole and a surface wiring pattern to which the via hole is electrically connected. The method comprises a step of preparing a sintered ceramic substrate having a via hole, a step of forming a sintered ceramic layer having a hole or an opening portion whose bottom is constituted of at least part of the exposed end surface of the via hole on the sintered ceramic substrate by the post-fire method, a step of forming a conductive portion electrically connecting the surface of the sintered ceramic layer and the via hole in the hole or opening portion, and a step of forming a surface wiring pattern electrically connecting to the conductive portion on the surface of the sintered ceramic layer. With this, even if a sintered ceramic substrate is manufactured by the co-fire method, the position of the connection between the via hole and the surface wiring pattern can be controlled with high precision, any problem such as short-circuit is not caused, and a fine wiring pattern with high precision can be formed on a ceramic substrate.
Inventors:
YAMAMOTO, Yasuyuki (1-1 Mikage-cho, Shunan-sh, Yamaguchi 48, 7458648, JP)
山本 泰幸 (〒48 山口県周南市御影町１番１号 株式会社トクヤマ内 Yamaguchi, 7458648, JP)
SUGAWARA, Ken (1-1 Mikage-cho, Shunan-sh, Yamaguchi 48, 7458648, JP)
山本 泰幸 (〒48 山口県周南市御影町１番１号 株式会社トクヤマ内 Yamaguchi, 7458648, JP)
SUGAWARA, Ken (1-1 Mikage-cho, Shunan-sh, Yamaguchi 48, 7458648, JP)
Application Number:
JP2007/067314
Publication Date:
March 13, 2008
Filing Date:
September 05, 2007
Export Citation:
Assignee:
TOKUYAMA CORPORATION (1-1 Mikage-cho, Shunan-shi Yamaguchi, 48, 7458648, JP)
株式会社トクヤマ (〒48 山口県周南市御影町１番１号 Yamaguchi, 7458648, JP)
YAMAMOTO, Yasuyuki (1-1 Mikage-cho, Shunan-sh, Yamaguchi 48, 7458648, JP)
山本 泰幸 (〒48 山口県周南市御影町１番１号 株式会社トクヤマ内 Yamaguchi, 7458648, JP)
株式会社トクヤマ (〒48 山口県周南市御影町１番１号 Yamaguchi, 7458648, JP)
YAMAMOTO, Yasuyuki (1-1 Mikage-cho, Shunan-sh, Yamaguchi 48, 7458648, JP)
山本 泰幸 (〒48 山口県周南市御影町１番１号 株式会社トクヤマ内 Yamaguchi, 7458648, JP)
International Classes:
H05K3/28; H05K3/40; H01L23/12
Attorney, Agent or Firm:
HOSHINO, Tetsuro et al. (3rd Floor Oak Building Kyobashi,16-10, Kyobashi 1-chom, Chuou-ku Tokyo 31, 1040031, JP)
Download PDF:
Previous Patent: LIPASE INHIBITOR
Next Patent: SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
Next Patent: SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD