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Patent Searching and Data


Title:
CERAMIC SUBSTRATE, AND MODULE WITH BUILT-IN ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2018/037842
Kind Code:
A1
Abstract:
This ceramic substrate is provided with: a ceramic element having a ceramic layer on the surface; and a surface electrode that is provided on one main surface of the ceramic element. The ceramic substrate is characterized in that: an oxide layer formed of an insulating oxide is formed between the surface electrode and the ceramic layer, said oxide having a melting point that is higher than the firing temperature of the ceramic layer; the oxide layer is also provided on a ceramic layer portion where the surface electrode is not provided; and the surface of the oxide layer on the ceramic layer portion where the surface electrode is not provided is a rough surface.

Inventors:
ASAI RYOTA (JP)
MATSUSHITA YOSUKE (JP)
Application Number:
PCT/JP2017/027723
Publication Date:
March 01, 2018
Filing Date:
July 31, 2017
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K3/38; C04B41/90; H01L23/13; H01L25/00; H05K1/03; H05K3/46
Foreign References:
JP2003110238A2003-04-11
JPH10256731A1998-09-25
JP2005197354A2005-07-21
Attorney, Agent or Firm:
YASUTOMI & ASSOCIATES (JP)
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