Title:
CERAMIC WIRING BOARD, ELECTRONIC DEVICE AND ELECTRONIC MODULE
Document Type and Number:
WIPO Patent Application WO/2023/163066
Kind Code:
A1
Abstract:
The present invention provides: a ceramic wiring board which is thin and still has higher toughness and high bonding strength with a wiring line; an electronic device; and an electronic module. A ceramic wiring board (21) according to the present invention is provided with: a ceramic sintered body (211) which is mainly composed of an alumina crystal phase and a zirconia crystal phase, while containing manganese oxide and silica as minor components; and a wiring line (212) which is mainly composed of molybdenum and is arranged at least either on the surface or in the inner part of the ceramic sintered body (211). The zirconia crystal phase contains first crystal grains (211a) and second crystal grains (211b), each of which has a larger grain size than the first crystal grains (211a); and some of the second crystal grains (211b) positioned at the interface between the ceramic sintered body (211) and the wiring line (212) may have entered into a recessed part of the wiring line (212).
Inventors:
YAMAMOTO MAKOTO (JP)
Application Number:
PCT/JP2023/006541
Publication Date:
August 31, 2023
Filing Date:
February 22, 2023
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H01L23/13; H05K1/03
Domestic Patent References:
| WO2016098767A1 | 2016-06-23 | |||
| WO2012060341A1 | 2012-05-10 |
Foreign References:
| JPH0729764A | 1995-01-31 |
Attorney, Agent or Firm:
ARAFUNE Hiroshi et al. (JP)
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