Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
CERIUM BASED ABRASIVE MATERIAL AND METHOD FOR EVALUATING CERIUM BASED ABRASIVE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2002/048280
Kind Code:
A1
Abstract:
A cerium based abrasive material containing 40 wt % or more of cerium oxide (relative to the total rare earth oxides), wherein the material contains fluorine in an amount of 0.5 to 10 wt % in terms of atomic weight relative to the cerium based abrasive material and comprises abrasive grains composed of crystals having a lattice constant in the range of 0.544 to 0.560 nm as measured by the powder X-ray diffractometry; and a method for evaluating a cerium based abrasive material which comprises the steps of subjecting the material to an analysis by the powder X-ray diffractometry, wherein the diffraction angle ($g(u)) of at least one maximum peak of the four maximum peaks appearing in the specific four ranges is determined, and calculating from the angle the lattice constant of the crystal constituting abrasive grains of the material. The cerium based abrasive is capable of forming a surface polished with improved accuracy and also exhibits improved machining capability; and the method for evaluation allows relatively simple and easy evaluation of a cerium based abrasive material.

More Like This:
WO/2016/104869POLISHING PARTICLES AND POLISHING SLURRY COMPOSITION CONTAINING SAME
JPH05261666COATED ABRASIVE HAVING OVERCOATING OF EPOXY RESIN COATABLE FROM WATER
Inventors:
YAMASAKI HIDEHIKO (JP)
UCHINO YOSHITSUGU (JP)
TAKAHASHI KAZUAKI (JP)
Application Number:
PCT/JP2001/010879
Publication Date:
June 20, 2002
Filing Date:
December 12, 2001
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
MITSUI MINING & SMELTING CO (JP)
YAMASAKI HIDEHIKO (JP)
UCHINO YOSHITSUGU (JP)
TAKAHASHI KAZUAKI (JP)
International Classes:
B24D3/34; C01F17/259; C09G1/02; C09K3/14; G01N23/20; (IPC1-7): C09K3/14; C01F17/00; B24B37/00; G01N23/20; G01N33/40
Foreign References:
EP0153227A11985-08-28
JP2000026840A2000-01-25
EP0239478A21987-09-30
EP0031749A21981-07-08
JPH11269455A1999-10-05
JPH09183966A1997-07-15
JP2000188270A2000-07-04
Other References:
See also references of EP 1342766A4
Attorney, Agent or Firm:
Tanaka, Daisuke (15-2 Hongo 1-chome Bunkyo-ku, Tokyo, JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: ABRASIVE, ABRASIVE SLURRY, AND METHOD FOR MANUFACTURING ABRASIVE

Next Patent: HYDROGEN SULPHIDE SCAVENGING METHOD